Synaptics Incorporated
Semiconductor device having a communication bus

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Abstract:

A semiconductor device for an input device comprises a die body comprising sensor circuitry, a plurality of pads and a sensor bus. The sensor circuitry is configured to operate a plurality of sensor electrodes disposed in a single layer for capacitive sensing. A first pad of the plurality of pads is configured to be coupled to a first sensor electrode of the plurality of sensor electrodes, a second pad of the plurality of pads is configured to be coupled to a second sensor electrode of the plurality of sensor electrodes, and a third pad of the plurality of pads is configured to be coupled to a third sensor electrode of the plurality of sensor electrodes. The sensor bus comprises a plurality of wires. A first wire of the plurality of wires is configured to couple the first pad and the second pad to a first transmitter of the sensor circuitry and a second wire of the plurality of wires is coupled to the third pad to a first receiver of the sensor circuitry.

Status:
Grant
Type:

Utility

Filling date:

26 Aug 2019

Issue date:

11 May 2021