Gentherm Incorporated
THERMOELECTRIC MODULE WITH INTEGRATED PRINTED CIRCUIT BOARD

Abstract:

A thermoelectric module assembly for thermally conditioning a component is includes first and second heat spreaders spaced apart from one another and at least one thermoelectric sub-assembly between and in thermal communication with the first and second heat spreaders. The at least one thermoelectric sub-assembly includes a plurality of thermoelectric devices and a printed circuit board having a plurality of electrical conduits. Each of the thermoelectric devices has a first end portion and a second end portion, the second end portion opposite from the first end portion, the first end portion mechanically coupled to the printed circuit board and in electrical communication with the plurality of electrical conduits, and the second end portion spaced from the printed circuit board.