Taiwan Semiconductor Manufacturing Company Limited
METHOD AND DEVICE TO REDUCE EPITAXIAL DEFECTS DUE TO CONTACT STRESS UPON A SEMICONDCUTOR WAFER

Abstract:

A method of transferring semiconductor wafers and a semiconductor wafer support device including lift pins having a first end configured to contact a backside surface of the semiconductor wafer and at least one stress reduction feature. The stress reduction feature may be configured to reduce contact stress between the lift pins and the wafer.