Taiwan Semiconductor Manufacturing Company Limited
MAGNETIC TUNNEL JUNCTION MEMORY CELL WITH A BUFFER-LAYER AND METHODS FOR FORMING THE SAME
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Abstract:
A memory cell structure including a dielectric cap layer disposed over a substrate and a first dielectric layer disposed over the dielectric cap layer. The memory cell structure may further include a buffer layer disposed over the first dielectric layer, a connection via structure embedded in the buffer layer, the first dielectric layer, and the dielectric cap layer. The memory cell structure may further include may further include a bottom electrode disposed on the connection via structure and the buffer layer, and a magnetic tunnel junction (MTJ) memory cell including one or more MTJ layers disposed on the bottom electrode.
Status:
Application
Type:
Utility
Filling date:
19 Oct 2020
Issue date:
21 Apr 2022