Taiwan Semiconductor Manufacturing Company Limited
MOSFET device structure with air-gaps in spacer and methods for forming the same

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Abstract:

A transistor device and method of making the same are disclosed. The transistor device includes one or more air gaps in one or more sidewall spacers. The one or more air gaps may be located adjacent the gate and/or above the source or drain regions of the device. Various embodiments may include different combinations of air gaps formed in one or both sidewall spacers. Various embodiments may include air gaps formed in one or both sidewall spacers adjacent to the gate and/or above the source or drain regions of the device. The formation of the air gaps may reduce unwanted parasitic and/or fringing capacitance.

Status:
Grant
Type:

Utility

Filling date:

31 Mar 2020

Issue date:

21 Jun 2022