Taiwan Semiconductor Manufacturing Company Limited
TUNGSTEN DEPOSITION ON A COBALT SURFACE

Last updated:

Abstract:

In some implementations, one or more semiconductor processing tools may deposit cobalt material within a cavity of the semiconductor device. The one or more semiconductor processing tools may polish an upper surface of the cobalt material. The one or more semiconductor processing tools may perform a hydrogen soak on the semiconductor device. The one or more semiconductor processing tools may deposit tungsten material onto the upper surface of the cobalt material.

Status:
Application
Type:

Utility

Filling date:

21 Jan 2021

Issue date:

21 Jul 2022