Taiwan Semiconductor Manufacturing Company Limited
 TUNGSTEN DEPOSITION ON A COBALT SURFACE
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Abstract:
In some implementations, one or more semiconductor processing tools may deposit cobalt material within a cavity of the semiconductor device. The one or more semiconductor processing tools may polish an upper surface of the cobalt material. The one or more semiconductor processing tools may perform a hydrogen soak on the semiconductor device. The one or more semiconductor processing tools may deposit tungsten material onto the upper surface of the cobalt material.
Status: 
 
                        Application 
Type: 
 Utility
Filling date: 
 21 Jan 2021
Issue date: 
21 Jul 2022