Taiwan Semiconductor Manufacturing Company Limited
TUNGSTEN DEPOSITION ON A COBALT SURFACE
Last updated:
Abstract:
In some implementations, one or more semiconductor processing tools may deposit cobalt material within a cavity of the semiconductor device. The one or more semiconductor processing tools may polish an upper surface of the cobalt material. The one or more semiconductor processing tools may perform a hydrogen soak on the semiconductor device. The one or more semiconductor processing tools may deposit tungsten material onto the upper surface of the cobalt material.
Status:
Application
Type:
Utility
Filling date:
21 Jan 2021
Issue date:
21 Jul 2022