Taiwan Semiconductor Manufacturing Company Limited
Semiconductor arrangement with airgap and method of forming

Last updated:

Abstract:

A semiconductor arrangement includes a gate structure disposed between a first source/drain region and a second source/drain region and a first contact disposed over the first source/drain region. The semiconductor arrangement includes a second contact disposed over the second source/drain region and an airgap disposed between the first contact and the second contact and over the gate structure.

Status:
Grant
Type:

Utility

Filling date:

14 Jun 2019

Issue date:

16 Aug 2022