Taiwan Semiconductor Manufacturing Company Limited
Semiconductor arrangement with airgap and method of forming
Last updated:
Abstract:
A semiconductor arrangement includes a gate structure disposed between a first source/drain region and a second source/drain region and a first contact disposed over the first source/drain region. The semiconductor arrangement includes a second contact disposed over the second source/drain region and an airgap disposed between the first contact and the second contact and over the gate structure.
Status:
Grant
Type:
Utility
Filling date:
14 Jun 2019
Issue date:
16 Aug 2022