Taiwan Semiconductor Manufacturing Company Limited
Method of manufacturing semiconductor device comprising doped gate spacer

Last updated:

Abstract:

A semiconductor device includes a substrate, at least one source drain feature, a gate structure, and at least one gate spacer. The source/drain feature is present at least partially in the substrate. The gate structure is present on the substrate. The gate spacer is present on at least one sidewall of the gate structure. At least a bottom portion of the gate spacer has a plurality of dopants therein.

Status:
Grant
Type:

Utility

Filling date:

19 Sep 2018

Issue date:

29 Dec 2020