Taiwan Semiconductor Manufacturing Company Limited
Semiconductor device and method for forming the same

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Abstract:

Semiconductor devices and a method for forming the same are provided. In various embodiments, a method for forming a semiconductor device includes receiving a semiconductor substrate including a channel. An atmosphere-modulation layer is formed over the channel. An annealing process is performed to form an interfacial layer between the channel and the atmosphere-modulation layer.

Status:
Grant
Type:

Utility

Filling date:

14 Jan 2019

Issue date:

29 Dec 2020