Taiwan Semiconductor Manufacturing Company Limited
 Methods and systems for dopant activation using microwave radiation
 Last updated:
Abstract:
A semiconductor structure includes a substrate, a source/drain (S/D) junction, and an S/D contact. The S/D junction is associated with the substrate and includes a trench-defining wall, a semiconductor layer, and a semiconductor material. The trench-defining wall defines a trench. The semiconductor layer is formed over the trench-defining wall, partially fills the trench, substantially covers the trench-defining wall, and includes germanium. The semiconductor material is formed over the semiconductor layer and includes germanium, a percentage composition of which is greater than a percentage composition of the germanium of the semiconductor layer. The S/D contact is formed over the S/D junction.
Status: 
 
                        Grant 
Type: 
 Utility
Filling date: 
 24 Dec 2019
Issue date: 
16 Feb 2021