Taiwan Semiconductor Manufacturing Company Limited
Semiconductor arrangement and method of manufacture

Last updated:

Abstract:

A method of forming a semiconductor arrangement includes forming a gate dielectric layer over a semiconductor layer. A gate electrode layer is formed over the gate dielectric layer. A first gate mask is formed over the gate electrode layer. The gate electrode layer is etched using the first gate mask as an etch template to form a first gate electrode. A first dopant is implanted into the semiconductor layer using the first gate mask and the first gate electrode as an implantation template to form a first doped region in the semiconductor layer.

Status:
Grant
Type:

Utility

Filling date:

1 Apr 2019

Issue date:

17 Nov 2020