Taiwan Semiconductor Manufacturing Company Limited
Semiconductor device having gate body and inhibitor film between conductive prelayer over gate body and conductive layer over inhibitor film
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Abstract:
One or more semiconductor devices are provided. The semiconductor device comprises a gate body, a conductive prelayer over the gate body, at least one inhibitor film over the conductive prelayer and a conductive layer over the at least one inhibitor film, where the conductive layer is tapered so as to have a top portion width that is greater than the bottom portion width. One or more methods of forming a semiconductor device are also provided, where an etching process is performed to form a tapered opening such that the tapered conductive layer is formed in the tapered opening.
Status:
Grant
Type:
Utility
Filling date:
29 Jun 2018
Issue date:
17 Dec 2019