Taiwan Semiconductor Manufacturing Company Limited
Systems and methods for die-to-die communication

Abstract:

Systems and methods for die-to-die communication are provided. A first transceiver disposed on a first die includes a transmission section configured to modulate first data onto a carrier signal having a first frequency. The first transceiver includes a reception section configured to receive signals from a transmission line. The reception section includes a filter configured to pass frequencies within a first passband that includes a second frequency. The first frequency is outside of the first passband. A second transceiver is disposed on a second die and is configured to communicate with the first transceiver via the transmission line. The second transceiver includes a transmission section configured to modulate second data onto a carrier signal having the second frequency. The second transceiver includes a reception section including a filter configured to pass frequencies within a second passband that includes the first frequency. The second frequency is outside of the second passband.