Taiwan Semiconductor Manufacturing Company Limited
SEMICONDUCTOR ARRANGEMENT WITH AIRGAP AND METHOD OF FORMING

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Abstract:

A semiconductor arrangement includes a gate structure disposed between a first source/drain region and a second source/drain region and a first contact disposed over the first source/drain region. The semiconductor arrangement includes a second contact disposed over the second source/drain region and an airgap disposed between the first contact and the second contact and over the gate structure.

Status:
Application
Type:

Utility

Filling date:

14 Jun 2019

Issue date:

17 Dec 2020