Texas Instruments Incorporated
Integrated capacitor with extended head bump bond pillar

Abstract:

A microelectronic device has a die with a first electrically conductive pillar, and a second electrically conductive pillar, mechanically coupled to the die. The microelectronic device includes a first electrically conductive extended head electrically coupled to the first pillar, and a second electrically conductive extended head electrically coupled to the second pillar. The first pillar and the second pillar have equal compositions of electrically conductive material, as a result of being formed concurrently. Similarly, the first extended head and the second extended head have equal compositions of electrically conductive material, as a result of being formed concurrently. The first extended head provides a bump pad, and the second extended head provides at least a portion of a first plate of an integrated capacitor. A second plate may be located in the die, between the first plate and the die, or on an opposite of the first plate from the die.