Texas Instruments Incorporated
Module with reversely coupled inductors and magnetic molded compound (MMC)
Last updated:
Abstract:
A device includes a first inductor and a second inductor reversely coupled with the first inductor, wherein the first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor, wherein the housing is filled with a magnetic molding compound.
Status:
Grant
Type:
Utility
Filling date:
27 Dec 2018
Issue date:
17 Aug 2021