Texas Instruments Incorporated
Module with reversely coupled inductors and magnetic molded compound (MMC)

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Abstract:

A device includes a first inductor and a second inductor reversely coupled with the first inductor, wherein the first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor, wherein the housing is filled with a magnetic molding compound.

Status:
Grant
Type:

Utility

Filling date:

27 Dec 2018

Issue date:

17 Aug 2021