Texas Instruments Incorporated
HALL SENSOR PACKAGES

Last updated:

Abstract:

In some examples, a package comprises first and second terminals and a conductive pathway coupling the first and second terminals. The conductive pathway is configured to generate a magnetic field. The package comprises a conductive member aligned with and coupled to the conductive pathway. The conductive pathway and the conductive member have a common shape. The package also comprises an insulative layer coupled to the conductive member and a die coupled to the insulative layer and having a circuit configured to measure the magnetic field. The circuit faces the conductive pathway.

Status:
Application
Type:

Utility

Filling date:

7 Apr 2020

Issue date:

7 Oct 2021