Texas Instruments Incorporated
Microelectromechanical Device with Beam Structure over Silicon Nitride Undercut
Last updated:
Abstract:
In described examples, a microelectromechanical system (MEMS) is located on a substrate. A silicon nitride (SiN) layer on a portion of the substrate. A mechanical structure has first and second ends. The first end is embedded in the SiN layer, and the second end is cantilevered from the SiN layer.
Status:
Application
Type:
Utility
Filling date:
13 May 2021
Issue date:
18 Nov 2021