Texas Instruments Incorporated
Microelectromechanical Device with Beam Structure over Silicon Nitride Undercut

Last updated:

Abstract:

In described examples, a microelectromechanical system (MEMS) is located on a substrate. A silicon nitride (SiN) layer on a portion of the substrate. A mechanical structure has first and second ends. The first end is embedded in the SiN layer, and the second end is cantilevered from the SiN layer.

Status:
Application
Type:

Utility

Filling date:

13 May 2021

Issue date:

18 Nov 2021