Texas Instruments Incorporated
INTEGRATED CIRCUIT

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Abstract:

An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.

Status:
Application
Type:

Utility

Filling date:

30 Dec 2020

Issue date:

4 Nov 2021