Texas Instruments Incorporated
Module with Reversely Coupled Inductors and Magnetic Molded Compound (MMC)
Last updated:
Abstract:
A device includes a first inductor and a second inductor reversely coupled with the first inductor. The first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor. The housing is filled with a magnetic molding compound.
Status:
Application
Type:
Utility
Filling date:
17 Aug 2021
Issue date:
2 Dec 2021