Texas Instruments Incorporated
Module with Reversely Coupled Inductors and Magnetic Molded Compound (MMC)

Last updated:

Abstract:

A device includes a first inductor and a second inductor reversely coupled with the first inductor. The first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor. The housing is filled with a magnetic molding compound.

Status:
Application
Type:

Utility

Filling date:

17 Aug 2021

Issue date:

2 Dec 2021