Texas Instruments Incorporated
SURFACE MOUNT PACKAGE FOR A SEMICONDUCTOR DEVICE

Abstract:

A lead for a surface mount package for a semiconductor device, and the surface mount package employing the same. In one example, the lead includes a central segment with a first side and a second side, a first extension from a portion of the first side, and a second extension from a portion of the second side. The lead also includes a recess extending through a portion of the central segment, the first extension and the second extension.