Texas Instruments Incorporated
SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER

Abstract:

A semiconductor device assembly includes a package substrate having a top side including a plurality of bondable features, at least one integrated circuit (IC) die including a substrate having at least a semiconductor surface including circuitry configured for realizing at least one function including nodes coupled to bond pads with metal posts on the bond pads. The metal posts are attached by a solder joint to the bondable features. The solder joint has a void density of less than or equal to (.gtoreq.) 5% of a cross-sectional area of the solder joint.