Texas Instruments Incorporated
QUAD FLAT NO-LEAD (QFN) MANUFACTURING PROCESS

Abstract:

A lead frame includes a metal structure having opposite first and second sides and prospective device portions having leads with first and second lateral sides extending from a tie bar toward a die attach pad. One or more of the leads includes a first indent in the first lateral side that extends to the first side of the metal structure, and a second indent that extends to the second side of the metal to reduce saw blade loading and mitigate saw burr and lead smear during package singulation. A packaged electronic device includes a package structure, a semiconductor die enclosed by the package structure, and leads having a first side, a second side, and first and second lateral sides, where the leads include a first indent in the first lateral side that extends to the first side, and a second indent that extends to the second side of the lead.