Texas Instruments Incorporated
Open-Cavity Package for Chip Sensor

Abstract:

In described examples, a device includes an interconnect substrate that has an aperture through the interconnect substrate. An integrated circuit (IC) die that has an on-chip element is mounted on the interconnect substrate with the on-chip element aligned with and facing the aperture. The IC die is over-molded with mold compound only on one side of the interconnect substrate so that the aperture remains free of mold compound to allow the on-chip element to have access to the environment.