Viavi Solutions Inc.
REACTIVE SPUTTER DEPOSITION OF DIELECTRIC FILMS

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Abstract:

Reactive sputter deposition method and system are disclosed, in which a catalyst gas, such as water vapor, is used to increase the overall deposition rate substantially without compromising formation of a dielectric compound layer and its optical transmission. Addition to the sputtering or reactive gas of the catalyst gas can result in an increase of a deposition rate of the dielectric oxide film substantially without increasing an optical absorption of the film.

Status:
Application
Type:

Utility

Filling date:

5 Feb 2021

Issue date:

27 May 2021