Varex Imaging Corporation
Detector architecture using photodetector arrays on thinned substrates
Last updated:
Abstract:
Some embodiments include a method, comprising: attaching a carrier substrate to a side of at least one semiconductor substrate, the at least one semiconductor substrate including photodetectors on the side; thinning the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; attaching an optical substrate to the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; and removing the carrier substrate from the at least one semiconductor substrate.
Status:
Grant
Type:
Utility
Filling date:
21 Dec 2017
Issue date:
6 Apr 2021