Varex Imaging Corporation
Detector architecture using photodetector arrays on thinned substrates

Last updated:

Abstract:

Some embodiments include a method, comprising: attaching a carrier substrate to a side of at least one semiconductor substrate, the at least one semiconductor substrate including photodetectors on the side; thinning the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; attaching an optical substrate to the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; and removing the carrier substrate from the at least one semiconductor substrate.

Status:
Grant
Type:

Utility

Filling date:

21 Dec 2017

Issue date:

6 Apr 2021