Viasat, Inc.
Antenna apparatus with integrated antenna array and low loss multi-layer interposer

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Abstract:

Disclosed is an antenna apparatus including a radiating layer with a plurality of antenna elements forming an antenna array; a semiconductor wafer including multiple tiles each having beamforming circuits; and a multi-layer interposer. The multi-layer interposer may include: a lower dielectric layer adjacent to the substrate; an upper dielectric layer adjacent to the radiating layer; a metal layer between the lower and upper layers and including a plurality of conductive traces; a plurality of first vias extending through both the upper and lower layers and electrically coupling the beamforming circuits to the plurality of antenna elements; and a plurality of second vias extending between the beamforming circuits and the conductive traces to interconnect the tiles.

Status:
Grant
Type:

Utility

Filling date:

17 Oct 2019

Issue date:

29 Jun 2021