Xilinx, Inc.
Warpage reduction

Abstract:

Examples described herein provide a method for reducing warpage when stacking semiconductor substrates. In an example, a first substrate is bonded with a second substrate to form a stack. The first substrate comprises a first semiconductor substrate, and the second substrate comprises a second semiconductor substrate. The second semiconductor substrate is thinned, and a first trench is etched into a backside of the thinned second semiconductor substrate. A first stressed material is deposited into the first trench.