Xilinx, Inc.
Test vehicle for package testing

Abstract:

A test vehicle, along with methods for fabricating and using a test vehicle, are disclosed herein. In one example, a test vehicle is provided that includes a substrate, at least a first passive die mounted on the substrate, and at least a first test die mounted on the substrate. The first test die includes test circuitry configured to test continuity through solder interconnects formed between the substrate and the first passive die.