KLA Corporation
System and method for semiconductor device print check alignment

Abstract:

A system includes a controller communicatively coupled to an optical inspection sub-system, the controller configured to: receive training images of a sample; identify alignment targets in the master die; receive a first set of reference images of a first die row of a sample, the first die row including a master die and a first set of reference die; align the first set of reference die to the master die via fine alignment processes to generate a first set of aligned reference images of the first row; receive a second set of reference images of a second die row of the sample; align the second set of reference die to the master die based on the alignment targets and the training images using a course alignment offset value; and align the second set of reference die to the master die via a fine alignment process.