KLA Corporation
Clustering Sub-Care Areas Based on Noise Characteristics
Last updated:
Abstract:
A care area is determined in an image of a semiconductor wafer. The care area is divided into sub-care areas based on the shapes of polygons in a design file associated with the care area. A noise scan of a histogram for the sub-care areas is then performed. The sub-care areas are clustered into groups based on the noise scan of the histogram.
Status:
Application
Type:
Utility
Filling date:
9 Nov 2020
Issue date:
27 May 2021