KLA Corporation
Clustering Sub-Care Areas Based on Noise Characteristics

Last updated:

Abstract:

A care area is determined in an image of a semiconductor wafer. The care area is divided into sub-care areas based on the shapes of polygons in a design file associated with the care area. A noise scan of a histogram for the sub-care areas is then performed. The sub-care areas are clustered into groups based on the noise scan of the histogram.

Status:
Application
Type:

Utility

Filling date:

9 Nov 2020

Issue date:

27 May 2021