KLA Corporation
Signal-Domain Adaptation for Metrology

Abstract:

First and second metrology data are used to train a machine-learning model to predict metrology data for a metrology target based on metrology data for a device area. The first metrology data are for a plurality of instances of a device area on semiconductor die fabricated using a fabrication process. The second metrology data are for a plurality of instances of a metrology target that contains structures distinct from structures in the device area. Using the trained machine-learning model, fourth metrology data are predicted for the metrology target based on third metrology data for an instance of the device area. Using a recipe for the metrology target, one or more parameters of the metrology target are determined based on the fourth metrology data. The fabrication process is monitored and controlled based at least in part on the one or more parameters.