KLA Corporation
In Situ Process Chamber Chuck Cleaning by Cleaning Substrate

Last updated:

Abstract:

A cleaning assembly is disclosed. The cleaning assembly includes a substrate. One or more patterns are formed on a bottom side of the substrate. One or more structures within the one or more patterns attract one or more particles from a chuck via at least one of electrostatic attraction or mechanical trapping when the substrate is positioned on the chuck.

Status:
Application
Type:

Utility

Filling date:

13 Nov 2019

Issue date:

10 Dec 2020