KLA Corporation
In Situ Process Chamber Chuck Cleaning by Cleaning Substrate
Last updated:
Abstract:
A cleaning assembly is disclosed. The cleaning assembly includes a substrate. One or more patterns are formed on a bottom side of the substrate. One or more structures within the one or more patterns attract one or more particles from a chuck via at least one of electrostatic attraction or mechanical trapping when the substrate is positioned on the chuck.
Status:
Application
Type:
Utility
Filling date:
13 Nov 2019
Issue date:
10 Dec 2020