KLA Corporation
Apparatus and Method for Measuring Topography and Gradient of the Surfaces, Shape, and Thickness of Patterned and Unpatterned Wafers

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Abstract:

An interferometer system may include a stage assembly configured to receive and secure a sample, an illumination source configured to generate an illumination beam, a half-wave plate, one or more shearing prisms to shear the illumination beam into two beamlets along a shearing direction, a reference flat disposed proximate to the sample, a detector assembly, and a controller. The controller may cause the illumination source to generate an illumination beam and sweep the illumination beam across a plurality of wavelengths, and determine both a surface height measurement and a surface slope measurement of the sample based on the illumination received by the detector assembly.

Status:
Application
Type:

Utility

Filling date:

19 Jul 2019

Issue date:

30 Jan 2020