Lam Research Corporation
UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION

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Abstract:

This disclosure relates generally to a patterning structure including an underlayer and an imaging layer, as well as methods and apparatuses thereof. In particular embodiments, the underlayer provides an increase in radiation absorptivity and/or patterning performance of the imaging layer.

Status:
Application
Type:

Utility

Filling date:

11 Jan 2021

Issue date:

3 Feb 2022