Lam Research Corporation
Underlayer for photoresist adhesion and dose reduction
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Abstract:
This disclosure relates generally to a patterning structure including an underlayer and an imaging layer, as well as methods and apparatuses thereof. In particular embodiments, the underlayer provides an increase in radiation absorptivity and/or patterning performance of the imaging layer.
Status:
Grant
Type:
Utility
Filling date:
11 Jan 2021
Issue date:
26 Apr 2022