Lam Research Corporation
SELECTIVE ETCH USING A SACRIFICIAL MASK
Last updated:
Abstract:
A method for selectively etching a silicon oxide region with respect to a lower oxygen silicon containing region is provided. A sacrificial mask selectively deposited on the lower oxygen silicon containing region with respect to the silicon oxide region. An atomic layer etch selectively etches the silicon oxide region with respect to the sacrificial mask on the lower oxygen silicon containing region.
Status:
Application
Type:
Utility
Filling date:
11 Feb 2020
Issue date:
21 Apr 2022