Lam Research Corporation
REDUCED DIAMETER CARRIER RING HARDWARE FOR SUBSTRATE PROCESSING SYSTEMS

Abstract:

A substrate support for a substrate processing system includes a baseplate, a ceramic layer arranged on the baseplate, and a carrier ring arranged on the ceramic layer. The ceramic layer has a first outer diameter, the carrier ring has a second outer diameter that is less than the first outer diameter, the ceramic layer includes a shoulder that extends from the second outer diameter of the carrier ring to the first outer diameter, and the shoulder slopes downward toward the first outer diameter.