Lam Research Corporation
ATOMIC LAYER ETCHING METHODS AND APPARATUS

Abstract:

A multi-station process tool for performing atomic layer etching of a surface of a substrate, includes: a first station having a first pedestal that supports the substrate when in the first station, the first pedestal being heated to a first predefined temperature; wherein the first station is configured to perform a surface conversion operation, by exposing an entirety of the surface of the substrate to a surface conversion reactant; a second station having a second pedestal that supports the substrate when in the second station, the second pedestal being heated to a second predefined temperature; wherein the second station is configured to perform a ligand exchange operation, by exposing the entirety of the surface of the substrate to a ligand containing reactant, wherein the second pedestal being heated to the second predefined temperature causes desorption of surface species, generated from the ligand exchange operation, from the surface of the substrate.