Lam Research Corporation
COOLING SYSTEM FOR RF POWER ELECTRONICS
Last updated:
Abstract:
A cooling apparatus is provided. At least one power electronic component is provided. A fluid tight enclosure surrounds the at least one power electronic component. An inert dielectric fluid at least partially fills the fluid tight container and is in contact with the at least one power electronic component.
Status:
Application
Type:
Utility
Filling date:
6 Dec 2019
Issue date:
9 Apr 2020