Lam Research Corporation
Methods and Systems for Controlling Wafer Fabrication Process

Abstract:

A method for controlling a semiconductor fabrication process includes determining a representative feature within a given area on a wafer. The representative feature has a critical dimension (CD) response to a specified process control parameter that is correlated to a CD response to the specified process control parameter of other features within the given area on the wafer. A CD adjustment is determined for the representative feature to achieve a target CD for the representative feature. The CD response to the specified process control parameter for the representative feature and the CD adjustment for the representative feature are used to determine an adjustment to the specified process control parameter that will drive a CD of the representative feature to the target critical dimension for the representative feature. A process controller is updated to implement the adjustment to the specified process control parameter during subsequent processing of another wafer.