Lam Research Corporation
TEMPERATURE CONTROL SYSTEMS AND METHODS FOR REMOVING METAL OXIDE FILMS

Abstract:

A processing method includes: loading, onto a substrate support of a processing chamber, a substrate having a metal oxide film deposited on a surface of the substrate; based on a predetermined temperature, controlling a temperature of coolant provided to coolant channels through the substrate support, where the predetermined temperature is less than 50 degrees Celsius; and, while controlling the temperature of the coolant based on the predetermined temperature, selectively etching the metal oxide film including: flowing molecular hydrogen into the processing chamber; and striking plasma within the processing chamber.