Lam Research Corporation
VIA PREFILL IN A FULLY ALIGNED VIA

Abstract:

An electrically conductive structure in an integrated circuit (IC) includes a bottom metal line and a top metal line with via providing electrical interconnection between the bottom metal line and the top metal line. The via is fully aligned with both the bottom metal line and the top metal line. An electrically conductive material fills an opening formed in a dielectric material to form the via, and the electrically conductive material is directly in contact with the bottom metal line. No diffusion barrier layer and/or liner layer is between the bottom metal line and the via.