Lam Research Corporation
ELECTROSTATIC CHUCKING PEDESTAL WITH SUBSTRATE BACKSIDE PURGING AND THERMAL SINKING
Last updated:
Abstract:
An electrostatic substrate chuck with substrate backside purging to prevent incidental backside deposition and that provides thermal sinking to prevent or mitigate the failure of seals.
Status:
Application
Type:
Utility
Filling date:
1 Feb 2018
Issue date:
1 Aug 2019