Lam Research Corporation
Atomic layer etch of tungsten for enhanced tungsten deposition fill

Last updated:

Abstract:

Methods of depositing tungsten into high aspect ratio features using a dep-etch-dep process integrating various deposition techniques with alternating pulses of surface modification and removal during etch are provided herein.

Status:
Grant
Type:

Utility

Filling date:

26 May 2020

Issue date:

20 Jul 2021