Lam Research Corporation
Atomic layer etch of tungsten for enhanced tungsten deposition fill
Last updated:
Abstract:
Methods of depositing tungsten into high aspect ratio features using a dep-etch-dep process integrating various deposition techniques with alternating pulses of surface modification and removal during etch are provided herein.
Status:
Grant
Type:
Utility
Filling date:
26 May 2020
Issue date:
20 Jul 2021