Lam Research Corporation
Enhanced automatic wafer centering system and techniques for same

Last updated:

Abstract:

Systems and techniques for determining and correcting inter-wafer misalignments in a stack of wafers transported by a wafer handling robot are discussed. An enhanced automatic wafer centering system is provided that may be used to determine a smallest circle associated with the stack of wafers, which may then be used to determine whether or not the stack of wafer meets various process requirements and/or if a centering correction can be made to better align the wafers with a receiving station coordinate frame.

Status:
Grant
Type:

Utility

Filling date:

5 Nov 2018

Issue date:

6 Oct 2020