Lam Research Corporation
Method to form ultrashallow junctions using atomic layer deposition and annealing

Abstract:

A method for processing a substrate includes providing a substrate with a layer including a material selected from a group consisting of silicon (Si), germanium (Ge) and silicon germanium. The method includes depositing a first layer on the layer of the substrate using atomic layer deposition (ALD). The method includes depositing a second layer on the first layer using ALD. Depositing one of the first layer and the second layer includes depositing phosphorus oxide and depositing the other one of the first layer and the second layer includes depositing antimony oxide. The method includes annealing the substrate to drive antimony and phosphorus from the first layer and the second layer into the layer of the substrate to create a junction.