Apple Inc.
System In Package for Lower Z Height and Reworkable Component Assembly

Abstract:

Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.