Apple Inc.
HIGH DENSITY PICK AND SEQUENTIAL PLACE TRANSFER PROCESS AND TOOL

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Abstract:

Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.

Status:
Application
Type:

Utility

Filling date:

11 Jun 2021

Issue date:

13 Jan 2022