Apple Inc.
High Density Pick and Sequential Place Transfer Process and Tool
Last updated:
Abstract:
Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.
Status:
Application
Type:
Utility
Filling date:
11 Jun 2021
Issue date:
13 Jan 2022